Interoperability: Fully compatible with all SEMI standard FOUPs.
Cleanliness: Better than Class 1 particle performance when integrated in Class 100 or better environment.
Reliability: Robust design combined with precision assembly achieves superior dependability and lifetime performance.
Zero Preventative Maintenance: Superior precision design requires no periodic lubrication or re-alignment.
Repeatability: Industry leading design utilizes DSP controlled electro-mechanical/pneumatic closed-loop servos for precise repeatable motion.
Wafer Mapping: High performance Break-The-Beam wafer mapping option allows fast, accurate wafer detection.
Fab Customization: Configurable features include programmable lights, buttons, carrier ID, and AMHS options.
Compliance*: SEMI, S2, S8, CE, and F47 compliant.
Bridge Tool: 200mm wafer operation (with insert @ 10mm pitch). |